Based on the idea of ​​the steady-state method, the classification of the LED substrate does not depend on the substrate material (organic, inorganic, metal-based), but on the detection data of the thermal conductivity of the surface direction and the thickness direction, considering the comprehensive heat dissipation capability of the substrates of different combinations. On the basis of the traditional steady-state method, the substrate surface temperature is not changed to reflect the thermal conductivity of the substrate, but the thermal resistance of the substrate is reflected by the thermal resistance change of the fixed heat source.
The new detection method proposes a unified heat source (TEG chip), unifies the sample specifications, and ensures the comparability of the comprehensive heat dissipation capability evaluation of the substrate, which provides a possibility for forming a cloud reference database later. The uniformity of the heat source and the sample specifications also eliminates the influence of the heat source and the heat consumption of the sample itself on the test results.
The correct test temperature test data accuracy premise can be started from two aspects: 1 to ensure that the ambient temperature and humidity is stable, preferably placed in a constant temperature and humidity environment, to reduce the error caused by air flow; 2 to ensure the temperature sensor measurement accuracy, improve measurement accuracy.
Since the TEG chip is fixed on the sample for testing, the operations involved in the process are fixed and welded, and the solder joint and the wire are preferably used for fixing the heat conductive adhesive.
1 fixed: can directly refer to the coating requirements and operations in the LED process.
2 welding: Here refers to the processing of the bonding wire, the soldering point is mainly to ensure the electrical performance, normal conduction can be. The requirements of the wire are small heat loss and good electrical conductivity during the test, that is, materials satisfying low thermal conductivity and low temperature coefficient of resistance.
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